Papers: 10.3390/polym13183085

https://doi.org/10.3390/polym13183085

Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC

Cited by: 9
Author(s): Shuang Yan, Wolfgang Verestek, Harald Zeizinger, Siegfried Schmauder
Published: almost 4 years ago

Software Mentions 2