Papers: 10.3390/s131216281

https://doi.org/10.3390/s131216281

Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer

Cited by: 18
Author(s): Lei Su, Tielin Shi, Zhenghua Xu, Xiangning Lu, Guanglan Liao
Published: almost 13 years ago

Software Mentions 1