Ecosyste.ms: Papers
An open API service providing mapping between scientific papers and software projects that are mentioned in them.
All mentions data is based on the CZI Software Mentions dataset.
Papers: 10.3390/polym13111734
https://doi.org/10.3390/polym13111734
Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis
Cited by: 11
Author(s): Erick Franieck, M. Fleischmann, O. Hölck, L. V. Kutuzova, Andreas Kandelbauer
Published: over 3 years ago