Papers: 10.3390/polym13111734

https://doi.org/10.3390/polym13111734

Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

Cited by: 11
Author(s): Erick Franieck, M. Fleischmann, O. Hölck, L. V. Kutuzova, Andreas Kandelbauer
Published: about 5 years ago

Software Mentions 1