Papers: 10.3390/mi9100519

https://doi.org/10.3390/mi9100519

Tunnel Encapsulation Technology for Durability Improvement in Stretchable Electronics Fabrication

Cited by: 6
Author(s): Kangmin Leng, Chuan Fei Guo, Kang Wu, Zhigang Wu
Published: almost 8 years ago

Software Mentions 1